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Thermal Simulations of 3-D Integrated Multi-Chip Module With GaN Power Amplifier and Si Modulator

Author(s):
Publication title:
State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XLIII) and Nitride and Wide Bandgap Semiconductors for Sensors, Photonics, and Electronics VI
Title of ser.:
ECS transactions
Ser. no.:
1(2)
Pub. date:
2006
Page(from):
94
Page(to):
102
Pages:
9
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566774314 [1566774314]
Language:
English
Call no.:
E23400/1-2
Type:
Conference Proceedings

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