Experimental Investigation and Numerical Simulation of Pad Stain Formation During Copper CMP

Experimental Investigation and Numerical Simulation of Pad Stain Formation During Copper CMP

Author(s):

Hyosang Lee

Publication title:

Advances and challenges in chemical mechanical planarization : symposium held April 10-12, 2007, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

991

Pub. Year:

2007

Page(from):

165

Page(to):

170

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558999510 [1558999515]

Language:

English

Call no.:

M23500/991

Type:

Conference Proceedings

Details

TDL ID:	ZA00048533
Series ID:	PA00000011
Conf. info. (Name):	MRS Spring Meeting
Conf. info. (Number):	2007
Conf. info. (Venue):	San Francisco, California, USA
Conf. info. (Date):	2007.04.10-2007.04.12

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