LER transfer from a mask to wafers
- Author(s):
H. Tanabe ( Intel Corp. (Japan) ) G. Yoshizawa ( Intel Corp. (Japan) ) Y. Liu ( Intel Corp. (USA) ) V. L. Tolani ( Intel Corp. (USA) ) K. Kojima ( Dai Nippon Printing Co., Ltd. (Japan) ) N. Hayashi ( Dai Nippon Printing Co., Ltd. (Japan) ) - Publication title:
- Photomask and next-generation lithography mask technology XIV
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6607
- Pub. Year:
- 2007
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819467454 [0819467456]
- Language:
- English
- Call no.:
- P63600/6607
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Defect inspection and repair performance on CPL masks for 90- and 65-nm node line patterns
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |
8
Conference Proceedings
Distribution control of protecting groups and its effect on LER for EUV molecular resist
SPIE - The International Society of Optical Engineering |
3
Conference Proceedings
Image-based metrology software for analysis of features on masks and wafers
SPIE - The International Society of Optical Engineering |
9
Conference Proceedings
Development and evaluation of chromium-based attenuated phase-shift masks for DUV exposure
Society of Photo-optical Instrumentation Engineers |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
Considering MEEF in inverse lithography technology (ILT) and source mask optimization (SMO)
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |