Embodiment of optical interconnection circuits for the mobile phone application

Embodiment of optical interconnection circuits for the mobile phone application

Author(s):

J.-W. Seo ( Samsung Electronics (South Korea) )
S.-M. Seo ( Samsung Electronics (South Korea) )
Y.-K. Oh ( Samsung Electronics (South Korea) )
D.-H. Jang ( Samsung Electronics (South Korea) )

Publication title:

Photonic materials, devices, and applications II : 2-4 May 2007, Maspalomas, Gran Canaria, Spain

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6593

Pub. Year:

2007

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819467218 [0819467219]

Language:

English

Call no.:

P63600/6593

Type:

Conference Proceedings

Details

TDL ID:	ZA00046900
Series ID:	PA00000029
Conf. info. (Name):	Microtechnologies for the New Millennium : Photonic Materials, Devices, and Applications
Conf. info. (Number):	2007 : 2nd
Conf. info. (Venue):	Maspalomas, Gran Canaria, Spain
Conf. info. (Date):	2007.05.02-2007.05.04

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