A systematic approach for capturing interconnects hot spots

A systematic approach for capturing interconnects hot spots

Author(s):

M. Al-Imam ( Mentor Graphics Corp. (USA) )

H. Y. Liao ( Mentor Graphics Corp. (USA) )

J. Schacht ( Mentor Graphics Corp. (USA) )

T. H. Wu ( United Microelectronics Corp. (Taiwan) )

C. W. Huang ( United Microelectronics Corp. (Taiwan) )

S. Y. Huang ( United Microelectronics Corp. (Taiwan) )

P. R. Tsai ( United Microelectronics Corp. (Taiwan) )

C. H. Yang ( United Microelectronics Corp. (Taiwan) )

3 more

Publication title:

Design for manufacturability through design-process integration : 28 February-2 March 2007, San Jose, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6521

Pub. Year:

2007

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819466402 [0819466409]

Language:

English

Call no.:

P63600/6521

Type:

Conference Proceedings

Details

TDL ID:	ZA00046828
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Design for Manufacturability through Design-Process Integration
Conf. info. (Number):	2007
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2007.02.28-2007.03.02

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