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OPC and design verification for DFM using die-to-database inspection

Author(s):
J. Kim ( Hynix Semiconductor, Inc. (South Korea) )
H. Yang ( Hynix Semiconductor, Inc. (South Korea) )
J. Song ( Hynix Semiconductor, Inc. (South Korea) )
D. Yim ( Hynix Semiconductor, Inc. (South Korea) )
T. Hasebe ( NanoGeometry Research Inc. (Japan) )
M. Yamamoto ( NanoGeometry Research Inc. (Japan) )
1 more
Publication title:
Design for manufacturability through design-process integration : 28 February-2 March 2007, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6521
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819466402 [0819466409]
Language:
English
Call no.:
P63600/6521
Type:
Conference Proceedings

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