Blank Cover Image

DFM flow by using combination between design based metrology system and model based verification at sub-50nm memory device

Author(s):
  • C. Kim ( Hynix Semiconductor, Inc. (South Korea) )
  • J. Kim ( Hynix Semiconductor, Inc. (South Korea) )
  • J. Choi ( Hynix Semiconductor, Inc. (South Korea) )
  • H. Yang ( Hynix Semiconductor, Inc. (South Korea) )
  • D. Yim ( Hynix Semiconductor, Inc. (South Korea) )
Publication title:
Design for manufacturability through design-process integration : 28 February-2 March 2007, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6521
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819466402 [0819466409]
Language:
English
Call no.:
P63600/6521
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Considerations of model-based OPC verification for sub-70nm memory device [6156-39]

Kim, C.-K., Choi, J.-S, Narn, B.-H, Yim, D.

SPIE - The International Society of Optical Engineering
7 Conference Proceedings Wide applications of design based metrology with tool integration

H. Yang, J. Kim, A. Jung, T. Lee, D. Yim

Society of Photo-optical Instrumentation Engineers
2 Conference Proceedings DFM based on layout restriction and process window verification for sub-60nm memory devices

S. -H. Choi, D. -H. Jung, J. -S. Hong, J. -H. Choi, M. -H. Yoo, J. -T. Kong

SPIE - The International Society of Optical Engineering
8 Conference Proceedings New PEC optimization for the mask fabrication of sub-50nm memory device

S. Lee, D. Ryu, J. Park, D. Nam, H. Kim, B. Kim, S. Woo, H. Cho

SPIE - The International Society of Optical Engineering
3 Conference Proceedings OPC and design verification for DFM using die-to-database inspection

J. Kim, H. Yang, J. Song, D. Yim, T. Hasebe, M. Yamamoto

SPIE - The International Society of Optical Engineering
9 Conference Proceedings DFM application on dual tone sub 50nm device

B.-S. Nam, J. Moon, J.-H. Jeong, D.-H. Kong, S. Oh

Society of Photo-optical Instrumentation Engineers
4 Conference Proceedings Highly accurate modeling by using 2-dimensional calibration data set for model-based OPC verification [6283-104]

Kim, -K. C., Choi, -S. J., Nam, -H. B., Yim, D.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings Resolution enhancement techniques for contact hole printing of sub-50nm memory device

H. Shin, T. You, M. Yoo, J. Choi, K. Yang

Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings Highly accurate model-based verification using SEM image calibration method

B. Cho, D. Park, D. Chang, J. Choi, C. Kim, D. Yim, J. Kim

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Advanced process control with design-based metrology

H. Yang, J. Kim, J. Hong, D. Yim, T. Hasebe, M. Yamamoto

SPIE - The International Society of Optical Engineering
6 Conference Proceedings OPC accuracy and process window verification methodology for sub-100-nm node

Yang, H., Park, C., Hong, J., Jeong, G., Cho, B., Choi, J., Kang, C., Yang, K., Kang, E., Ji, S., Yim, D., Song, Y.

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Highly accurate hybrid-OPC method for sub-60nm memory device [6156-42]

Yune, H.-S., Kim, C.-K., Ahn Y B, Nam B H, Yim D

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12