Double patterning design split implementation and validation for the 32nm node
- Author(s):
- M. Drapeau ( Synopsys, Inc. (Canada) )
- V. Wiaux ( IMEC (Belgium) )
- E. Hendrickx ( IMEC (Belgium) )
- S. Verhaegen ( IMEC (Belgium) )
- T. Machida ( Renesas Technology Corp. (Japan) )
- Publication title:
- Design for manufacturability through design-process integration : 28 February-2 March 2007, San Jose, California, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6521
- Pub. Year:
- 2007
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819466402 [0819466409]
- Language:
- English
- Call no.:
- P63600/6521
- Type:
- Conference Proceedings
Similar Items:
Society of Photo-optical Instrumentation Engineers |
7
Conference Proceedings
Application challenges with double patterning technology (DPT) beyond 45 nm [6349-75]
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
8
Conference Proceedings
Lithography and yield sensitivity analysis of SRAM scaling for the 32nm node
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
9
Conference Proceedings
Litho variations and their impact on the electrical yield of a 32nm node 6T SRAM cell
Society of Photo-optical Instrumentation Engineers |
4
Conference Proceedings
Optical extensions integration for a 0.314-μm2 45-nm node 6-transistor SRAM cell
SPIE - The International Society of Optical Engineering |
10
Conference Proceedings
Double dipole lithography for 65-nm node and beyond: a technology readiness review
SPIE - The International Society of Optical Engineering |
5
Conference Proceedings
Lithography options for the 32nm half pitch node and their implications on resist and material technology
Society of Photo-optical Instrumentation Engineers |
Society of Photo-optical Instrumentation Engineers |
6
Conference Proceedings
Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications using RELACS shrink and corresponding OPC
SPIE - The International Society of Optical Engineering |
12
Conference Proceedings
Patterning control budgets for the 32-nm generation incorporating lithography, design, and RET variations
SPIE - The International Society of Optical Engineering |