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Three-dimensional mask effect approximate modeling for sub-50-nm node device OPC

Author(s):
S. Suh ( Samsung Electronics Co., Ltd. (South Korea) )
S. Lee ( Samsung Electronics Co., Ltd. (South Korea) )
K. Back ( Samsung Electronics Co., Ltd. (South Korea) )
Y. Kim ( Samsung Electronics Co., Ltd. (South Korea) )
S. Kim ( Samsung Electronics Co., Ltd. (South Korea) )
Y. Chun ( Samsung Electronics Co., Ltd. (South Korea) )
1 more
Publication title:
Design for manufacturability through design-process integration : 28 February-2 March 2007, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6521
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819466402 [0819466409]
Language:
English
Call no.:
P63600/6521
Type:
Conference Proceedings

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