Blank Cover Image

Process window and interlayer aware OPC for the 32-nm node

Author(s):
M. Terry ( Texas Instruments Inc. (USA) )
G. Zhang ( Texas Instruments Inc. (USA) )
G. Lu ( Texas Instruments Inc. (USA) )
S. Chang ( Texas Instruments Inc. (USA) )
T. Aton ( Texas Instruments Inc. (USA) )
R. Soper ( Texas Instruments Inc. (USA) )
M. Mason ( Texas Instruments Inc. (USA) )
S. Best ( Texas Instruments Inc. (USA) )
B. Dostalik ( Texas Instruments Inc. (USA) )
S. Hunsche ( Brion Technologies (USA) )
J. W. Li ( Brion Technologies (USA) )
R. Zhou ( Brion Technologies (USA) )
M. Feng ( Brion Technologies (USA) )
J. Burdorf ( Brion Technologies (USA) )
9 more
Publication title:
Optical microlithography XX
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6520
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819466396 [0819466395]
Language:
English
Call no.:
P63600/6520
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Finding the needle in the haystack: using full-chip process window analysis to qualify competing SRAF placement strategies for 65 nm [6349-70]

Mason, M., Best, S., Zhang, G., Terry, M., Soper, R.

SPIE - The International Society of Optical Engineering
7 Conference Proceedings Resist blur and line edge roughness (Invited Paper)

Zhang, G., Terry, M., O'Brien, S., Soper, R., Mason, M., Kim, W., Wang, C., Hansen, S., Lee, J., Ganeshan, J.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Rules based process window OPC

S. O'Brien, R. Soper, S. Best, M. Mason

Society of Photo-optical Instrumentation Engineers
8 Conference Proceedings Comparing traditional OPC to field-based OPC for 45-nm node production

R. Farnbach, J. Tuttle, M. S. John, R. Brown, D. Gerold, K. Lucas, R. Lugg, J. Shiely, M. Rieger

SPIE - The International Society of Optical Engineering
3 Conference Proceedings Design rule considerations for 65-nm node contact using off axis illumination

Jessen, S., Mason, M., O'Brien, S., Terry, M., Soper, R., Wolf, T.

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Phenomena and OPC solution of ripple patterns for 65-nm node

Lai, C.-M., Ho, J.-S., Lai, C.-W., Tsai, C.-K., Tsay, C.-S., Chen, J.-H., Liu, R.-G., Ku, Y.C., Lin, B.-J.

SPIE - The International Society of Optical Engineering
4 Conference Proceedings Challenges and solutions for trench lithography beyond 65nm node [6156-60]

Lu, Z., Ho, C.-C., Mason, M., Anderson, A., Mckee, R., Jackson, R., Zhu, C., Terry, M.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings Improvement of etching selectivity for 32-nm node mask making

C. L. Lu, L. Y. Hsia, T. H. Cheng, S. C. Chang, W. C. Wang, H. J. Lee, Y. C. Ku

SPIE - The International Society of Optical Engineering
5 Conference Proceedings OPC accuracy and process window verification methodology for sub-100-nm node

Yang, H., Park, C., Hong, J., Jeong, G., Cho, B., Choi, J., Kang, C., Yang, K., Kang, E., Ji, S., Yim, D., Song, Y.

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Litho-aware extraction for the 32nm double patterning node

J. Huckabay, Q. Chen, C. Thayer, R. Naber

Society of Photo-optical Instrumentation Engineers
6 Conference Proceedings OPC aware mask and wafer metrology

Maurer, W., Wiaux, V., Jonckheere, R.M., Philipsen, V., Hoffmann, T., Verhaegen, S., Ronse, K.G., England, J.G., Howard, …

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Empirical study of OPC metrology requirements for 32-nm node logic

B. S. Ward, L. Zavylova, P. de Bisschop, J. van de Kerkhove

Society of Photo-optical Instrumentation Engineers
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12