Fast and accurate 3D mask model for full-chip OPC and verification
- Author(s):
P. Liu ( Brion Technologies, Inc. (USA) ) Y. Cao ( Brion Technologies, Inc. (USA) ) L. Chen ( Brion Technologies, Inc. (USA) ) G. Chen ( Brion Technologies, Inc. (USA) ) M. Feng ( Brion Technologies, Inc. (USA) ) J. Jiang ( Brion Technologies, Inc. (USA) ) H. Liu ( Brion Technologies, Inc. (USA) ) S. Suh ( Samsung Electronics, Co. LTD (South Korea) ) S. Lee ( Samsung Electronics, Co. LTD (South Korea) ) - Publication title:
- Optical microlithography XX
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6520
- Pub. Year:
- 2007
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819466396 [0819466395]
- Language:
- English
- Call no.:
- P63600/6520
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Predictive focus exposure modeling (FEM) for full-chip lithography [6154-66]
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
2
Conference Proceedings
Accurate gate CD control through the full-chip area using the dual model in the model-based OPC
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
3
Conference Proceedings
Validation of a fast and accurate 3D mask model for SRAF printability analysis at 32nm node
Society of Photo-optical Instrumentation Engineers |
9
Conference Proceedings
Dipole decomposition mask design for full-chip implementation at 100-nm technology node and beyond
SPIE-The International Society for Optical Engineering |
4
Conference Proceedings
Increasing post OPC layout verification coverage using a full-chip simulation based verification method
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
OPC in memory-device patterns using boundary layer model for 3-dimensional mask topographic effect
SPIE - The International Society of Optical Engineering |
11
Conference Proceedings
Highly accurate modeling by using 2-dimensional calibration data set for model-based OPC verification [6283-104]
SPIE - The International Society of Optical Engineering |
6
Conference Proceedings
OPC to account for thick mask effect using simplified boundary layer model [6349-133]
SPIE - The International Society of Optical Engineering |
12
Conference Proceedings
Toward DFM: process worthy design and OPC through verification method using MEEF, TF・MEEF, and MTT [6156-21]
SPIE - The International Society of Optical Engineering |