Depth-of-focus (DOF) and line-width roughness (LWR) performance of novel surface conditioner solutions for immersion lithography

Depth-of-focus (DOF) and line-width roughness (LWR) performance of novel surface conditioner solutions for immersion lithography

Author(s):

B. J. Lu ( United Microelectronics Corp. (Taiwan) )

Y. Huang ( United Microelectronics Corp. (Taiwan) )

H. T. Tseng ( United Microelectronics Corp. (Taiwan) )

C. C. Yu ( United Microelectronics Corp. (Taiwan) )

L. Meng ( Air Products and Chemicals, Inc. (USA) )

M. Liao ( Air Products and Chemicals, Inc. (USA) )

M. Legenza ( Air Products and Chemicals, Inc. (USA) )

2 more

Publication title:

Advances in resist materials and processing technology XXIV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6519

Pub. Year:

2007

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819466389 [0819466387]

Language:

English

Call no.:

P63600/6519

Type:

Conference Proceedings

Details

TDL ID:	ZA00046826
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in Resist Materials and Processing Technology
Conf. info. (Number):	2007 : 24th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2007.02.26-2007.02.28

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