Photoresist adhesion effect of resist reflow process
- Author(s):
J. Park ( Hanyang Univ. (South Korea) ) , ( Hynix Semiconductor Inc. (South Korea) ) J. Lee ( Hanyang Univ. (South Korea) ) M. Kim ( Seoul National Univ. (South Korea) ) J. Kim ( Seoul National Univ. (South Korea) ) S. Lee ( Seoul National Univ. (South Korea) ) C. Bok ( Hynix Semiconductor Inc. (South Korea) ) S. Moon ( Hynix Semiconductor Inc. (South Korea) ) S. Park ( Hanyang Univ. (South Korea) ) J. Hong ( Hanyang Univ. (South Korea) ) H. Oh ( Hanyang Univ. (South Korea) ) - Publication title:
- Advances in resist materials and processing technology XXIV
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6519
- Pub. Year:
- 2007
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819466389 [0819466387]
- Language:
- English
- Call no.:
- P63600/6519
- Type:
- Conference Proceedings
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