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Impact of airborne NH3 and humidity against wafer-to-wafer CD variation in ArF lithography through 45-nm technology node

Author(s):
  • R. Naito ( Tokyo Electron Kyushu Ltd. (Japan) )
  • Y. Matsuda ( Tokyo Electron Kyushu Ltd. (Japan) )
  • M. Shioguchi ( Tokyo Electron Kyushu Ltd. (Japan) )
  • T. Shibata ( Tokyo Electron Kyushu Ltd. (Japan) )
Publication title:
Advances in resist materials and processing technology XXIV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6519
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819466389 [0819466387]
Language:
English
Call no.:
P63600/6519
Type:
Conference Proceedings

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