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Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools

Author(s):
  • B. Lee ( Samsung Electronics Co., Ltd. (South Korea) )
  • J. Choi ( Samsung Electronics Co., Ltd. (South Korea) )
  • S. Chin ( Samsung Electronics Co., Ltd. (South Korea) )
  • D. Cho ( Samsung Electronics Co., Ltd. (South Korea) )
  • C. Song ( Samsung Electronics Co., Ltd. (South Korea) )
Publication title:
Metrology, inspection, and process control for microlithography XXI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6518
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819466372 [0819466379]
Language:
English
Call no.:
P63600/6518
Type:
Conference Proceedings

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