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Meeting overlay requirements for future technology nodes with in-die overlay metrology

Author(s):
B. Schulz ( AMD Saxony LLC and Co. KG (Germany) )
R. Seltmann ( AMD Fab36 LLC and Co. KG (Germany) )
J. Busch ( AMD Saxony LLC and Co. KG (Germany) )
F. Hempel ( AMD Fab36 LLC and Co. KG (Germany) )
E. Cotte ( AMTC GmbH and Co. KG (Germany) )
B. Alles ( Univ. of Technology Munich (Germany) )
1 more
Publication title:
Metrology, inspection, and process control for microlithography XXI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6518
Pub. date:
2007
Vol.:
6518
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819466372 [0819466379]
Language:
English
Call no.:
P63600/6518
Type:
Conference Proceedings

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