Meeting overlay requirements for future technology nodes with in-die overlay metrology
- Author(s):
B. Schulz ( AMD Saxony LLC and Co. KG (Germany) ) R. Seltmann ( AMD Fab36 LLC and Co. KG (Germany) ) J. Busch ( AMD Saxony LLC and Co. KG (Germany) ) F. Hempel ( AMD Fab36 LLC and Co. KG (Germany) ) E. Cotte ( AMTC GmbH and Co. KG (Germany) ) B. Alles ( Univ. of Technology Munich (Germany) ) - Publication title:
- Metrology, inspection, and process control for microlithography XXI
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6518
- Pub. Year:
- 2007
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819466372 [0819466379]
- Language:
- English
- Call no.:
- P63600/6518
- Type:
- Conference Proceedings
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