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Flexible polymer pillars for optical chip assembly: materials, structures, and characterization

Author(s):
M. S. Bakir ( Georgia Institute of Technology (USA) )
P. A. Kohl ( Georgia Institute of Technology (USA) )
A. L. Glebov ( Fujitsu Labs. of America (USA) )
E. Elce ( Promerus LLC (USA) )
D. Bhusari ( Georgia Institute of Technology (USA) )
M. G. Lee ( Fujitsu Labs. of America (USA) )
J. D. Meindl ( Georgia Institute of Technology (USA) )
2 more
Publication title:
Photonics packaging, integration, and interconnects VII : 23-25 January 2007, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6478
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819465917 [0819465917]
Language:
English
Call no.:
P63600/6478
Type:
Conference Proceedings

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