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Highly reliable hard-soldered 1.6kW QCW laser diode stack packaging platform

Author(s):
P. Rosenberg ( Coherent, Inc. (USA) )
P. Reichert ( Coherent, Inc. (USA) )
J. Du ( Coherent, Inc. (USA) )
M. Fouksman ( Coherent, Inc. (USA) )
H. Zhou ( Coherent, Inc. (USA) )
J. McNulty ( Coherent, Inc. (USA) )
S. Tolman ( Coherent, Inc. (USA) )
C. Luong ( Coherent, Inc. (USA) )
3 more
Publication title:
High-power diode laser technology and applications V : 22-24 January 2007, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6456
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819465696 [0819465690]
Language:
English
Call no.:
P63600/6456
Type:
Conference Proceedings

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