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Adhesive wafer-to-wafer bonding using contact imprinting

Author(s):
  • L. Yu ( Institute of Bioengineering and Nanotechnology (Singapore) and National Univ. of Singapore (Singapore) )
  • A. J. Pang ( Institute of Bioengineering and Nanotechnology (Singapore) )
  • B. Chen ( Institute of Bioengineering and Nanotechnology (Singapore) )
  • F. E. H. Tay ( Institute of Bioengineering and Nanotechnology (Singapore) and National Univ. of Singapore (Singapore) )
  • C. Iliescu ( Institute of Bioengineering and Nanotechnology (Singapore) )
Publication title:
Micro- and nanotechnology : materials, processes, packaging, and systems III : 11-13 December 2006, Adelaide, Australia
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6415
Pub. Year:
2007
Paper no.:
64151I
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819465238 [0819465232]
Language:
English
Call no.:
P63600/6415
Type:
Conference Proceedings

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