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Low Temperature Copper-Nanorod Bonding for 3-D Integration

Author(s):
Pei-I Wang
Tansel Karabacak
Jian Yu
Hui-Feng Li
Gopal G. Pethuraja
Sang Hwui Lee
Michael Z. Liu
J.-Q. Lu
T.-M. Lu
4 more
Publication title:
Enabling technologies for 3-D integration : symposium held November 27-29, 2006, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
970
Pub. Year:
2007
Page(from):
225
Page(to):
230
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558999275 [1558999272]
Language:
English
Call no.:
M23500/970
Type:
Conference Proceedings

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