Fabrication and Evaluation of 3-D Packages With Through Hole Via

Fabrication and Evaluation of 3-D Packages With Through Hole Via

Author(s):

Dong Min Jang

Publication title:

Enabling technologies for 3-D integration : symposium held November 27-29, 2006, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

970

Pub. Year:

2007

Page(from):

171

Page(to):

178

Pages:

8

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558999275 [1558999272]

Language:

English

Call no.:

M23500/970

Type:

Conference Proceedings

Details

TDL ID:	ZA00046625
Series ID:	PA00000011
Conf. info. (Name):	MRS Fall Meeting : Symposium Y
Conf. info. (Number):	2006
Conf. info. (Venue):	Boston, Massachusetts, USA
Conf. info. (Date):	2006.11.27-2006.11.29

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