Silicon Based System-in-Package : Breakthroughs in Miniaturization and 'Nano'-Integration Supported by Very High Quality Passives and System Level Design Tools

Silicon Based System-in-Package : Breakthroughs in Miniaturization and 'Nano'-Integration Supported by Very High Quality Passives and System Level Design Tools

Author(s):

Franck Murray

F. C. M. van den Heuvel

J. H. Klootwijk

Fred Roozeboom

3 more

Publication title:

Heterogeneous integration of materials for passive components and smart systems : symposium held November 27-29, 2006, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

969

Pub. Year:

2007

Page(from):

27

Page(to):

36

Pages:

10

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558999268 [1558999264]

Language:

English

Call no.:

M23500/969

Type:

Conference Proceedings

Details

TDL ID:	ZA00046624
Series ID:	PA00000011
Conf. info. (Name):	MRS Fall Meeting
Conf. info. (Number):	2006
Conf. info. (Venue):	Boston, Massachusetts, USA
Conf. info. (Date):	2006.11.27-2006.11.29

Similar Items:

1 Conference Proceedings Silicon Based System-in-Package: Breakthroughs in Miniaturization and 'Nano'-Integration Supported by Very High Quality Passives and System Level Design Tools Franck Murray, Francois LeCornec, Serge Bardy, Catherine Bunel, Jan Verhoeven, F. C. M. van den Heuvel, J. H. Klootwijk, … Materials Research Society	7 Technical Paper A Case Study in Systems Integration: The XM Central Control Unit Kaag,Francois, Bensaid,Franck, Herbault,Patrick "Society of Automotive Engineering, Inc."
2 Conference Proceedings More Than 'Moore': Towards Passive and Si-Based System-In-Package Integration (Invited) Roozeboom, F., Kemmeren, A.L.A.M., Verhoeven, J.F.C., van, F.C., Heuvel, den, Klootwijk, J., Kretschman, H., Fric, T., … Electrochemical Society	8 Conference Proceedings Nano power electronics: a breakthrough in the miniaturization of electronic systems and instruments Chakraborty, A., Emadi, A. SPIE - The International Society of Optical Engineering
3 Conference Proceedings Extremely High-Density Capacitors with ALD High-k Dielectric Layers Klootwijk, J., Kemmeren, A., Wolters, R., Roozeboom, F., Verhoeven, J., Van Den Heuvel, E. Springer	9 Conference Proceedings Actove Packaging: a New Fabrication Principle for High Performance Devices and Systems Luryi Serge Kluwer Academic Publishers
4 Conference Proceedings ALD Options for Si-integrated Ultrahigh-density Decoupling Capacitors in Pore and Trench Designs F. Roozeboom, J. Klootwijk, J. Verhoeven, E. van den Heuvel, W. Dekkers Electrochemical Society	10 Technical Paper A Tool for Integrating Commercial Space Operations into the National Airspace System D. Murray, R. VanSuetendael American Institute of Aeronautics and Astronautics
5 Conference Proceedings TEMPERATURE CONTROL AND SYSTEM DESIGN ASPECTS IN RAPID THERMAL PROCESSING Roozeboom, Fred Materials Research Society	11 Conference Proceedings Ultrashallow Junction Formation And Gate Activation In Deep-Submicron CMOS Stolk, Peter A., Cubaynes, Florence N., Meyssen, Veerle, Mannino, Giov'anni, Cowern, Nicholas E.B., Zijl, Jeroen van, … Materials Research Society
6 Conference Proceedings High-Density, Low-Loss MOS Decoupling Capacitors Integrated in a GSM Power Amplifier Roozeboom, F., Kemmeren, A., Verhoeven, J., van den Heuvel, E., Kretschman, H., Fric, T. Materials Research Society	12 Conference Proceedings Equilibria in Aqueous Electrolyte Systems at High Temperatures and Pressures Franck, E. U. American Chemical Society

1

2

3

4

5

6

7

8

9

10

11

12