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Layer Transfer of Hydrogen-Implanted Silicon Wafers by Thermal-Microwave Co-Activation

Author(s):
Y. Y. Yang
C. H. Huang
Y. -K. Hsu
S. -J. Jeng
C. -C. Tai
S. Lee
H. -W. Chen
Q. Gan
C. -S. Chu
J. -H. Ting
C. S. Lai
T. -H. Lee
7 more
Publication title:
Transistor scaling--methods, materials and modeling : symposium held April 18-19, 2006, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
913
Pub. date:
2006
Vol.:
913
Page(from):
111
Page(to):
118
Pages:
8
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998698 [1558998691]
Language:
English
Call no.:
M23500/913
Type:
Conference Proceedings

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