Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature

Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature

Author(s):

Publication title:

Recrystallization and grain growth III : proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX & GG III, held in Jeju Island, Korea, June 10-15 2007

Title of ser.:

Materials science forum

Ser. no.:

558-559(2)

Pub. Year:

2007

Vol.:

558-559

Page(from):

1261

Page(to):

1264

Pages:

4

Pub. info.:

Stafa-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494439 [087849443X]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00046612
Series ID:	PA00000012
Conf. info. (Name):	Joint International Conference on Recrystallization and Grain Growth
Conf. info. (Number):	3rd
Conf. info. (Venue):	Jeju Island, Korea
Conf. info. (Date):	2007.06.10-2007.06.15

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