The Effect of Copper Content on the Dynamic Grain Growth in AL-Cu-Zr Systems
- Author(s):
- Publication title:
- Recrystallization and grain growth III : proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX & GG III, held in Jeju Island, Korea, June 10-15 2007
- Title of ser.:
- Materials science forum
- Ser. no.:
- 558-559(1)
- Pub. Year:
- 2007
- Vol.:
- 558-559
- Page(from):
- 803
- Page(to):
- 810
- Pages:
- 8
- Pub. info.:
- Stafa-Zuerich: Trans Tech Publications
- ISSN:
- 02555476
- ISBN:
- 9780878494439 [087849443X]
- Language:
- English
- Call no.:
- M23650
- Type:
- Conference Proceedings
Similar Items:
Trans Tech Publications |
Trans Tech Publications |
Trans Tech Publications |
Trans Tech Publications |
Trans Tech Publications |
9
Conference Proceedings
Nucleation and Texture Development during Dynamic Recrystallization of Copper
Trans Tech Publications |
Trans Tech Publications |
10
Conference Proceedings
The Effect of Strain Rate History on the Dynamic Grain Growth Behaviour of AA 5083
Trans Tech Publications |
Trans Tech Publications |
Trans Tech Publications |
6
Conference Proceedings
Microstructure and Texture of Dynamically Recrystallized Copper and Copper - Tin Alloys
Trans Tech Publications |
Trans Tech Publications |