Blank Cover Image

Annealing Behavior during Heating Rate of Ultrafine-Grained 5052 Al Alloy deformed at Cryogenic Temperature

Author(s):
Publication title:
Recrystallization and grain growth III : proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX & GG III, held in Jeju Island, Korea, June 10-15 2007
Title of ser.:
Materials science forum
Ser. no.:
558-559(1)
Pub. date:
2007
Vol.:
558-559
Page(from):
735
Page(to):
740
Pages:
6
Pub. info.:
Stafa-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494439 [087849443X]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

Nam, W.J., Lee, Y.B., Shin, D.H.

Trans Tech Publications

G. Azevedo, R. Barbosa, E.V. Pereloma, D.B. Santos

Trans Tech Publications

B. Chen, J. Luo, Q. Yuan, D.F. Zhang, G.Z. Quan

Trans Tech Publications

J.C. Lee, U.G. Kang, C.S. Oh, S.J. Kim, W.J. Nam

Trans Tech Publications

Berta, M., Pragnell, P.B., Apps, P.J.

Springer

J.W. Lee, U.G. Kang, Y.S. Lee, K.T. Park, W.J. Nam

Trans Tech Publications

J.B. Singh, A. Sarkar, G. Sharma, V. Basavaraj, J.K. Chakravartty

Trans Tech Publications

D.G. Rodrigues, T.R. Oliveira, D.B. Santos, B.M. Gonzalez

Trans Tech Publications

Azevedo, G., Barbosa, R., Santos, D.B.

Trans Tech Publications

Bai, B.Z., Sun, X.J., Gu, J.L., Yang, L.Y.

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12