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The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing

Author(s):
Publication title:
Fundamentals of deformation and annealing : proceedings of the International Symposium held to coincide with the retirement of Professor John Humphreys in Manchester, UK, 5th-7th September 2006
Title of ser.:
Materials science forum
Ser. no.:
550
Pub. Year:
2007
Page(from):
399
Page(to):
404
Pages:
6
Pub. info.:
Uetikon-Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494347 [0878494340]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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