Direct Electroless Copper Plating on Polyimide for FPCB Applications

Direct Electroless Copper Plating on Polyimide for FPCB Applications

Author(s):: J.H. Lee
Publication title:: Eco-materials processing and design VIII : ISEPD-8, proceedings of the 8th International Symposium on Eco-Materials Processing and Design, January 11-13, 2007, Kitakyushu, Japan
Title of ser.:: Materials science forum
Ser. no.:: 544-545
Pub. Year:: 2007
Page(from):: 709
Page(to):: 712
Pages:: 4
Pub. info.:: Stafa-Zuerich, Switzerland: Trans Tech Publications
ISSN:: 02555476
ISBN:: 9780878494316 [0878494316]
Language:: English
Call no.:: M23650
Type:: Conference Proceedings

Details

TDL ID:	ZA00046600
Series ID:	PA00000012
Conf. info. (Name):	ISEPD - International Symposium on Eco-Materials Processing and Design
Conf. info. (Number):	2007 : 8th
Conf. info. (Venue):	Kitakyushu, Japan
Conf. info. (Date):	2007.01.11-2007.01.13

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