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Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test

Author(s):
D.G. Kim
J.W. Kim
S.S. Ha
J.M. Koo
B.I. Noh
S.B. Jung
1 more
Publication title:
Eco-materials processing and design VIII : ISEPD-8, proceedings of the 8th International Symposium on Eco-Materials Processing and Design, January 11-13, 2007, Kitakyushu, Japan
Title of ser.:
Materials science forum
Ser. no.:
544-545
Pub. Year:
2007
Page(from):
621
Page(to):
624
Pages:
4
Pub. info.:
Stafa-Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494316 [0878494316]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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