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The Effect of Crucible Configuration on Joule and Pinch Effects in EMCC Process of Silicon

Author(s):
Publication title:
THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada
Title of ser.:
Materials science forum
Ser. no.:
539-543(4)
Pub. Year:
2007
Vol.:
539-543
Page(from):
3179
Page(to):
3183
Pages:
5
Pub. info.:
Stafa-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494286 [0878494286]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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