Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying

Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying

Author(s):

Publication title:

Progress in powder metallurgy : proceedings of the 2006 Powder Metallurgy World Congress & Exhibition (PM 2006), held in Busan Exhibition & Convention Center (BEXCO), Busan, Korea, September 24-28, 2006

Title of ser.:

Materials science forum

Ser. no.:

534-536

Pub. Year:

2007

Pt.:

1

Page(from):

425

Page(to):

428

Pages:

4

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494194 [0878494197]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00046592
Series ID:	PA00000012
Conf. info. (Name):	Powder Metallurgy World Congress & Exhibition - PM
Conf. info. (Number):	2006
Conf. info. (Venue):	Busan, Korea
Conf. info. (Date):	2006.09.24-2006.09.28

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