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Modeling of Back Pressure Distribution on the Wafer Loaded in a Multi-Zone Carrier in Chemical Mechanical Polishing

Author(s):
Publication title:
Advances in materials manufacturing science and technology II : selected papers from the 12th International Manufacturing Conference in China, September 21-23, 2006, Xi'an, China
Title of ser.:
Materials science forum
Ser. no.:
532-533
Pub. Year:
2006
Page(from):
233
Page(to):
236
Pages:
4
Pub. info.:
Uetikon-Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494217 [0878494219]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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