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Full-chip lithography manufacturability check for yield improvement [6156-33]

Author(s):
Huang, Y. ( United Microelectronics Corp. (Taiwan) )
Tseng, E. ( United Microelectronics Corp. (Taiwan) )
Lin, B. S.-M ( United Microelectronics Corp. (Taiwan) )
Yu, C. C. ( United Microelectronics Corp. (Taiwan) )
Wang, C.-W. ( Brion Technologies (USA) )
Liu, H.-Y. ( Brion Technologies (USA) )
1 more
Publication title:
Design and process integration for microelectronic manufacturing IV : 23-24 February, 2006, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6156
Pub. Year:
2006
Page(from):
61560W
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461995 [0819461997]
Language:
English
Call no.:
P63600/6156
Type:
Conference Proceedings

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