Development of hot spot fixer (HSF) [6156-51]

Author(s):

Kotani, T. ( Toshiba Corp.,Semiconductor Co. (Japan) )

Kyoh, S. ( Toshiba Corp.,Semiconductor Co. (Japan) )

Kobayashi, S. ( Toshiba Corp.,Semiconductor Co. (Japan) )

Inazu, T. ( Toshiba Corp.,Semiconductor Co. (Japan) )

Ikeuchi, A. ( Toshiba Corp.,Semiconductor Co. (Japan) )

Urakawa, Y. ( Toshiba Corp.,Semiconductor Co. (Japan) )

Inoue, S. ( Toshiba Corp.,Semiconductor Co. (Japan) )

Morita, E. ( Takumi Technology Corp. (USA) )

Klaver, S. ( Takumi Technology Corp. (USA) )

Horiuchi, T. ( Takumi Technology Corp. (USA) )

Peeters, J. ( Takumi Technology Corp. (USA) )

Kuramoto, S. ( Takumi Technology Corp. (USA) )

7 more

Publication title:

Design and process integration for microelectronic manufacturing IV : 23-24 February, 2006, San Jose, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6156

Pub. Year:

2006

Page(from):

61560H

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819461995 [0819461997]

Language:

English

Call no.:

P63600/6156

Type:

Conference Proceedings