
LED packaging using high sag rectangular microlens array [6185-43]
- Author(s):
- Lim C.-H
- Jeung W.-K
- Choi S.-M ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )
- Publication title:
- Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6185
- Pub. Year:
- 2006
- Page(from):
- 618516
- Page(to):
- 618516
- Pages:
- 1
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819462411 [0819462411]
- Language:
- English
- Call no.:
- P63600/6185
- Type:
- Conference Proceedings
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