Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices [6376-02]

Author(s):

• Takigawa, R.
• Higurashi, E.
• Suga, T. ( Univ. of Tokyo (Japan) )
• Shinada, S.
• Kawanishi, T. ( National Institute of Information and Communications Technology (Japan) )

Publication title:

Optomechatronic Micro/Nano Devices and Components II

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6376

Pub. Year:

2006

Page(from):

637603

Page(to):

637603

Pages:

1

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819464743 [0819464740]

Language:

English

Call no.:

P63600/6376

Type:

Conference Proceedings