Blank Cover Image

Direct wafer bonding technology employing vacuum-cavity pre-bonding [6352-133]

Author(s):
Publication title:
Optoelectronic materials and devices : 5-7 September, 2006, Gwangju, South Korea
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6352
Pub. Year:
2006
Pt.:
2
Page(from):
63523I
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819464477 [0819464473]
Language:
English
Call no.:
P63600/6352
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Wafer-bonding technology and its applications in optoelectronic devices

Zhu,Z., Ding,G., Chen,K., Ejeckam,F.E., Qian,Y., Christenson,G.L., Lo,Y.-H.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings Fiber Bragg grating sensors array based on optical frequency domain reflectometry technology

Y. Xiong, L. He, T. Chen, X. Wang, W. Yang

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Mechanical Considerations for Direct Wafer Bonding

Bower, R.W., Hung, L., Chan, W., Watt, V.H.C.

Electrochemical Society
8 Conference Proceedings Integrated Optical Isolator Employing Nonreciprocal Phase Shift by Wafer Direct Bonding

Yokoi, H., Mizumoto, T.

MRS - Materials Research Society
3 Conference Proceedings Direct Wafer Bonding of Preamorphized Silicon Wafers

Laporte, A., Sarrabayrouse, G., Benamara, M., Claverie, A., Rocher, A., Lescouzeres, L., PeyreLavigne, A.

MRS - Materials Research Society
9 Conference Proceedings SILICON-SILICON DIRECT WAFER BONDING

D.L. Hughes

Electrochemical Society
4 Conference Proceedings Direct Bonding of Oxidized Cavity Wafers

M.O. Palokangas, J. Dekker, K. Henttinen, J. Mäkinen

Electrochemical Society
10 Conference Proceedings Spectrally selective infrared absorption enhancement in photonic crystal cavities

W. Zhou, Z. Qiang, L. Chen, H. Yang, G. J. Brown

Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings Effect of Pre-bonding Thermal Treatment on the Bonding Interface Evolution in Direct Si-Si Hydrophilic Wafer Bonding

C. Ventosa, F. Rieutord, L. Libralesso, F. Fournel, C. Morales

Electrochemical Society
11 Conference Proceedings LOW TEMPERTURE WAFER DIRECT BONDING

Q.-Y. Tong, G. Cha, R. Gafiteanu, U. Gosele

Electrochemical Society
6 Conference Proceedings Wafer bonding technology and its optoelectronic applications

Lo,Y.-H., Zhu,Z.-H., Qian,Y., Ejeckam,F.E., Christenson,G.L.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Surface-micromachined tunable resonant cavity LED using wafer bonding

Christenson,G.L., Tran,A.T.T.D., Zhu,Z.H., Lo,Y.H., Hong,M., Mannaerts,J.P., Bhat,R.J.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12