Blank Cover Image

Thermal analysis and design of high-power LED packages and systems (Invited Paper) [6337-27]

Author(s):
Publication title:
Sixth international conference on solid state lighting : 14-17 August 2006, San Diego, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6337
Pub. Year:
2006
Page(from):
63370U
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819464163 [0819464163]
Language:
English
Call no.:
P63600/6337
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Thermal design of high-power LED package and system (Invited Paper) [6355-10]

Shin, M. W.

SPIE - The International Society of Optical Engineering
7 Conference Proceedings Packaging and characteristics of a microfluorescence spectroscopy analyzer (Invited Paper) [6080-22]

Lo J, Fang, Q., Pang, W., Papaioannou T, Shui Q, Kim E S, Gundersen M A, Marcu L

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Thermal analysis of multichip LED packages [6355-15]

Kim, L., Choi, J., Jang, S., Shin, M. W.

SPIE - The International Society of Optical Engineering
8 Conference Proceedings VCSEL devices and packaging (Invited Paper)

Lebby,M.S., Claisse,P.R., Jiang,W., Kiley,P., Roll,M., Boughter,L., Sanchez,P., Lawrence,B.

SPIE-The International Society for Optical Engineering
3 Conference Proceedings Thermal analysis of water-level LED packages with multichips

J.-W. Choi, J.-M. Kang, J.-W. Kim, J.-H. Choi, D.-H. Kim

Society of Photo-optical Instrumentation Engineers
9 Conference Proceedings Thermal management of LEDs: package to system

Arik, M., Becker, C.A., Weaver, S.E., Petroski, J.

SPIE - The International Society of Optical Engineering
4 Conference Proceedings Characterization of thermal resistance coefficient of high-power LEDs [6337-28]

Jayasinghe, L., Gu, Y., Narendran, N.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings Development of Thermal Solution for High Power Flip Chip CPU Package

Kwon,H.K., Baek,J.H., Chun,J.W., Kim,M.H., Lee,T.K., Oh,S.Y., Ro,Y.H.

IMAPS, SPIE-The International Society for Optical
5 Conference Proceedings Color tunable LED spot lighting (Invited Paper) [6337-57]

Hoelen, C., Ansems, J., Deurenberg, P., van Dujineveldt, W., Peeters, M., Steenbruggen, G., Treurniet, T., Valster, A., …

SPIE - The International Society of Optical Engineering
11 Conference Proceedings LEDs on diamond (Invited Paper)

Fahrner,W.R., Zaitsev,A.M., Melnikov,A.A., Denisenko,A.V., Job,R., Lee,S.T.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Silicone materials for LED packaging [6337-13]

Bahadur, M., Norris, A. W., Zarisfi, A., Alger, J. S., Windiate, C. C.

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Thermal modeling and performance of LED packaging for illuminating device [6337-48]

Hwu, F. -S., Sheu, G. -J., Chen, J. -C.

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12