Uncooled IRFPA with chips scale vacuum package [6206-45]

Uncooled IRFPA with chips scale vacuum package [6206-45]

Author(s):

Hata H.

Takeda M. ( Mitsubishi Electric Corp. (Japan) )

Kimata M. ( Ritsumeikan Univ. (Japan) )

5 more

Publication title:

Infrared Technology and Applications XXXII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6206

Pub. Year:

2006

Pt.:

1

Page(from):

620619

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819462626 [0819462624]

Language:

English

Call no.:

P63600/6206

Type:

Conference Proceedings

Details

TDL ID:	ZA00016217
Series ID:	PA00000029
Conf. info. (Name):	Defense, Security, and Sensing : Infrared Technology and Applications
Conf. info. (Number):	2006 : 32th
Conf. info. (Venue):	Kissimmee, FL, USA
Conf. info. (Date):	2006.04.17-2006.04.21

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