On the modeling of piezoelectric wafer active sensor impedance analysis for structural health monitoring [6174-08]

On the modeling of piezoelectric wafer active sensor impedance analysis for structural health monitoring [6174-08]

Author(s):

Lin, B. ( Univ. of South Carolina (USA) )
Giurgiutiu, V. ( Univ. of South Carolina (USA) )

Publication title:

Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6174

Pub. Year:

2006

Pt.:

1

Page(from):

61740A

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819462275 [0819462276]

Language:

English

Call no.:

P63600/6174

Type:

Conference Proceedings

Details

TDL ID:	ZA00016205
Series ID:	PA00000029
Conf. info. (Name):	Smart structures and materials
Conf. info. (Number):	2006
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	2006.02.27-2006.03.02

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