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Simulation based post OPC verification to enhance process window critical failure analysis and yield [6154-137]

Author(s):
Kang, J. H. ( DongbuAnam Semiconductor (South Korea) )
Chol, J. Y. ( DongbuAnam Semiconductor (South Korea) )
Yun, K.H. ( DongbuAnam Semiconductor (South Korea) )
Do, M. ( DongbuAnam Semiconductor (South Korea) )
Lee, Y.S. ( DongbuAnam Semiconductor (South Korea) )
Kim, K. ( DongbuAnam Semiconductor (South Korea) )
1 more
Publication title:
Optical Microlithography XIX
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6154
Pub. Year:
2006
Pt.:
3
Page(from):
61543J
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461971 [0819461970]
Language:
English
Call no.:
P63600/6154
Type:
Conference Proceedings

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