New OPC verification method using die-to-database inspection [6152-119]
- Author(s):
Yang, H. ( Hynix Semiconductor Inc. (South Korea) ) Choi, J. ( Hynix Semiconductor Inc. (South Korea) ) Cho, B ( Hynix Semiconductor Inc. (South Korea) ) Hong, J. ( Hynix Semiconductor Inc. (South Korea) ) Song, J. ( Hynix Semiconductor Inc. (South Korea) ) Yim, D. ( Hynix Semiconductor Inc. (South Korea) ) Kim, J. ( Hynix Semiconductor Inc. (South Korea) ) Yamamoto. M. ( NanoGeometry Research Inc. (Japan) ) - Publication title:
- Metrology, Inspection, and Process Control for Microlithography XX
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6152
- Pub. Year:
- 2006
- Pt.:
- 2
- Page(from):
- 615232
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819461957 [0819461954]
- Language:
- English
- Call no.:
- P63600/6152
- Type:
- Conference Proceedings
Similar Items:
SPIE - The International Society of Optical Engineering |
7
Conference Proceedings
Considerations of model-based OPC verification for sub-70nm memory device [6156-39]
SPIE - The International Society of Optical Engineering |
2
Conference Proceedings
OPC accuracy and process window verification methodology for sub-100-nm node
SPIE - The International Society of Optical Engineering |
8
Conference Proceedings
Characterizing optical proximity effect difference among exposure tools [6152-103]
SPIE - The International Society of Optical Engineering |
3
Conference Proceedings
Highly accurate model-based verification using SEM image calibration method
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
10
Conference Proceedings
Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools
SPIE - The International Society of Optical Engineering |
5
Conference Proceedings
Highly accurate modeling by using 2-dimensional calibration data set for model-based OPC verification [6283-104]
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
6
Conference Proceedings
DFM flow by using combination between design based metrology system and model based verification at sub-50nm memory device
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |