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In-line monitoring of advanced copper CMP processes with picosecond ultrasonic metrology [6152-87]

Author(s):
Hsieh, M. H. ( United Microelectronics Corp. (Taiwan) )
Yeh, J. H. ( United Microelectronics Corp. (Taiwan) )
Tsai, M ( United Microelectronics Corp. (Taiwan) )
Yang, C ( United Microelectronics Corp. (Taiwan) )
Tan, J ( Rudolph Technologies (USA) )
Leary, S. P ( Rudolph Technologies (USA) )
1 more
Publication title:
Metrology, Inspection, and Process Control for Microlithography XX
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6152
Pub. Year:
2006
Pt.:
2
Page(from):
61522C
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461957 [0819461954]
Language:
English
Call no.:
P63600/6152
Type:
Conference Proceedings

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