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Fabrication of an optical-electrical printed circuit board (OE-PCB) by double-side lamination of an embedded polymer waveguide board between two electrical printed circuit boards [6124-35]

Author(s):
  • Lee, H.-J. ( Inha Univ. (South Korea) )
  • An, S. ( Inha Univ. (South Korea) )
  • O B H ( Inha Univ. (South Korea) )
  • Lee S G ( Inha Univ. (South Korea) )
  • Lee, E H ( Inha Univ. (South Korea) )
Publication title:
Optoelectronic Integrated Circuits VIII
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6124
Pub. Year:
2006
Page(from):
61241A
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461667 [0819461660]
Language:
English
Call no.:
P63600/6124
Type:
Conference Proceedings

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