Diode laser welding for packaging of transparent micro-structured polymer chips (Invited Paper) [6107-04]

Diode laser welding for packaging of transparent micro-structured polymer chips (Invited Paper) [6107-04]

Author(s):

Klotzbuecher, T. ( Institut fur Mikrotechnik Mainz GmbH (Germany) )
Letschert, M. ( Institut fur Mikrotechnik Mainz GmbH (Germany) )
Braune, T. ( Institut fur Mikrotechnik Mainz GmbH (Germany) )
Drese, K -S ( Institut fur Mikrotechnik Mainz GmbH (Germany) )
Doll, T. ( Institut fur Mikrotechnik Mainz GmbH (Germany) )

Publication title:

Laser-based Micropackaging

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6107

Pub. Year:

2006

Page(from):

610704

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819461490 [0819461490]

Language:

English

Call no.:

P63600/6107

Type:

Conference Proceedings

Details

TDL ID:	ZA00016141
Series ID:	PA00000029
Conf. info. (Name):	SPIE LASE : Laser-based micropackaging
Conf. info. (Number):	2006
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2006.01.25-2006.01.26

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