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A new laser bonding method of anisotropic conductive films in flat panel display and in semiconductor packaging (Invited Paper) [6107-01]

Author(s):
  • Nam, G -J ( Institute for Advanced Engineering (South Korea) )
  • Seo, M -H ( Institute for Advanced Engineering (South Korea) )
  • Ryu, K -H ( Institute for Advanced Engineering (South Korea) )
  • Kwak, N -H ( Jettech, Ltd. (South Korea) )
Publication title:
Laser-based Micropackaging
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6107
Pub. date:
2006
Page(from):
610701
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461490 [0819461490]
Language:
English
Call no.:
P63600/6107
Type:
Conference Proceedings

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