Wavelet-trnform-based method of analysis for ultrasonic NDT signals MMC adhesive interface [6040-44]

Wavelet-trnform-based method of analysis for ultrasonic NDT signals MMC adhesive interface [6040-44]

Author(s):

Dun Y.
Shi X.
Xu Z.
Wang F. ( Mechanical Engineering College (China) )

Publication title:

ICMIT 2005: mechatronics, MEMS, and smart materials : 20-23 September 2005, Changchun, China

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6040

Pub. Year:

2005

Page(from):

604018

Page(to):

604018

Pages:

1

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819460721 [0819460729]

Language:

English

Call no.:

P63600/6040

Type:

Conference Proceedings

Details

TDL ID:	ZA00016075
Series ID:	PA00000029
Conf. info. (Name):	ICMIT - International Conference on Mechatronics and Information Technology
Conf. info. (Number):	2005 : 3rd
Conf. info. (Venue):	Changchun, China
Conf. info. (Date):	2005.09.20-2005.09.23

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