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Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method [5852-147]

Author(s):
Publication title:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5852
Pub. Year:
2005
Pt.:
2
Page(from):
938
Page(to):
944
Pages:
7
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819458520 [081945852X]
Language:
English
Call no.:
P63600/5852
Type:
Conference Proceedings

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