Mechanical properties of lead-free solder alloys evaluated by miniature size specimen [5852-48]

Author(s):

• Kariya, Y.
• Asai, T. ( National Institute for Materials Science (Japan) )
• Suga, T. ( The Univ. of Tokyo (Japan) )

Publication title:

Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5852

Pub. Year:

2005

Pt.:

1

Page(from):

297

Page(to):

301

Pages:

5

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819458520 [081945852X]

Language:

English

Call no.:

P63600/5852

Type:

Conference Proceedings