Evaluation of Deformation Behavior in Cu Thin Film under Tensile and Fatigue Loading by X-Ray Method

Evaluation of Deformation Behavior in Cu Thin Film under Tensile and Fatigue Loading by X-Ray Method

Author(s):

Publication title:

Residual stresses VII : ECRS 7 : proceedings of the 7th European conference on residual stresses, Berlin, Germany, 13-15 September 2006

Title of ser.:

Materials science forum

Ser. no.:

524-525

Pub. Year:

2006

Page(from):

807

Page(to):

812

Pages:

6

Pub. info.:

Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494149 [0878494146]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00015828
Series ID:	PA00000012
Conf. info. (Name):	European Conference on Residual Stresses
Conf. info. (Number):	7th
Conf. info. (Venue):	Berlin, Germany
Conf. info. (Date):	2006.09.13-2006.09.15

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